Job Details:

Job Description:

Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Develops assembly processes and/or equipment and applies innovative engineering concepts to enable Intel’s future assembly packaging platform technologies. Optimizes and improves manufacturing processes to meet quality, reliability, cost, yield, productivity, and manufacturability goals.

Develops process and equipment specifications using principles of design of experiments (DOE), data analysis, and statistical methods to support process development and continuous improvement initiatives. Documents technical findings, improvements, and best practices through technical reports and white papers.

Develops, maintains, and evaluates equipment and processes used to assess silicon and package technologies under simulated field-use conditions, including heat, humidity, temperature cycling, and dynamic force environments. Ensures manufacturability of package designs and supports manufacturing process flows, procedures, and implementation activities.

Collaborates with cross-functional engineering, manufacturing, supplier quality, and procurement teams to establish material specifications and ensure vendor performance and material quality standards are met. Supports process and equipment innovation efforts focused on reliability, quality, and manufacturing efficiency.

Leads problem-solving and process improvement activities using experimental design methodologies and engineering analysis techniques. Provides technical consultation related to packaging and manufacturing process improvements and supports customer or stakeholder requests as needed.

Continuously partners with packaging technology development and engineering teams to drive process standardization, manufacturing quality improvements, and future technology readiness.

Qualifications:

You must possess the below minimum qualifications to be initially considered for this position.
Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

Bachelor’s degree in Mechanical Engineering, Electrical Engineering, Chemical Engineering, Materials Science Engineering, Industrial Engineering, or a related engineering or science discipline with 5+ years of engineering industry experience; OR
Master’s degree in a related engineering field with 3+ years of engineering industry experience; OR
PhD in a related engineering field with 6+ months of engineering industry experience.

Preferred Qualifications:

Experience in semiconductor manufacturing and/or advanced packaging technologies.
Experience with packaging process development, assembly equipment, or manufacturing optimization.
Knowledge of reliability testing, failure analysis, and process qualification methods.
Experience working in high-volume manufacturing or technology development environments.
Strong collaboration and communication skills with cross-functional teams and external suppliers.

Job Type:

Experienced Hire

Shift:

Shift 1 (United States of America)

Primary Location:

US, Arizona, Phoenix

Additional Locations:

Business group:

Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.

Packaging Module Equipment Development Engineer

intel

Job Description