staff Engineer , Packaging Engineering ( IC Packaging)

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape.

Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality.

Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward.

The Staff Packaging engineer will be an individual contributor and should be able to perform package design related to flash memory products

• As a IC packaging engineer, you will work in the Packaging R&D group on package deign, modeling and simulation across semiconductor packaging, flash memory product, and host levels. ( mainly on BGA / system in packages )
• In this position, you will be responsible for influencing package and product design  and advancing the technology of semiconductor packaging generally. 
• Scope is to address all design aspects of packaging technology and associated material and process interactions. 
• Knowledge of semiconductor assembly process is required ( back grinding , dicing , Die attach , wire bonding, molding , laser marking , laser cutting , singulation , solder ball attach , reflow , SMT, testing )
• Higher Die stacking and its wire bonding / molding concept to be known
• Focus will be on solutions to meet increased demands for small form factor packages with thinner chips, denser interconnects and higher power. 
• Candidate will be responsible for the modeling and simulation of mechanical responses of the IC package and flash products using analytical and computational tools. 
• Working knowledge on AI/ML , data science must
• This position will interface with package & product design, electrical and physical characterization, lab testing, failure analysis, assembly R&D and other process teams. 
• Interacting with internal engineering departments, vendors and customers to develop high performance leadership package
• Ability to daily multi-tasking in different projects, manage and meet tight deadlines of packaging deliverables as a part of multidisciplinary team as well as excellent communication and interpersonal skills required.
• Knowledge of Package signal integrity and power integrity principles would be good. Knowledge of EMI, HFSS, HSPICE is a plus. Hands-on with oscilloscopes, network analyzers and spectrum analyzers also a plus
•  Skills in AutoCAD, Cadence APD, Finite Element Analysis, Design of Experiments, statistical techniques and package failure analysis techniques are good.

• B.Tech or M.Tech in mechanical / microelectronics / mechatronics / Thermal/ electronics engineering
• Solid knowledge through academic coursework subjects  
• Background in applied mechanics with emphasis on both analytical and computational methods.
• AutoCAD must
• Broad knowledge of mechanical behaviours of various material types, such as ceramics and glass, polymers, and metals (e.g., solder).
• Strong oral and written communication skills.
• Demonstrated strong work ethic.
• Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.

Sandisk thrives on the power and potential of diversity. As a global company, we believe the most effective way to embrace the diversity of our customers and communities is to mirror it from within. We believe the fusion of various perspectives results in the best outcomes for our employees, our company, our customers, and the world around us. We are committed to an inclusive environment where every individual can thrive through a sense of belonging, respect and contribution.

Sandisk is committed to offering opportunities to applicants with disabilities and ensuring all candidates can successfully navigate our careers website and our hiring process. Please contact us at jobs.accommodations@sandisk.com to advise us of your accommodation request. In your email, please include a description of the specific accommodation you are requesting as well as the job title and requisition number of the position for which you are applying.