Sr. Package Mechanical Engineer

The candidate will be part of the data centre group at MediaTek. In this role, the designer will be working with the package and board design teams to design thermal solutions required for board level designs taking into account thermal, structural and electrical considerations. The candidate will also design sockets as required for test vehicles and validation boards. They will perform structural simulation studies to understand the impact of warpage on packages and work across engineering teams to come up with solutions for the same.

• Preferred candidate will have a Bachelors/ Masters degree in Mechanical Engineering with 10 12 years of relevant experience.
• Experience in performing structural simulations for motherboards/ packages
• Previous experience in package socket design
• Experience in mechanical design and CAE modelling
• Good understanding of different manufacturing techniques and experience in GD&T for various manufacturing processes
• Experienced user of simulation tools Ansys Simcentre; Creo/ Solidworks
• Must have good communication & problem-solving skills