Process Engineer - Solder Paste Printing and Reflow Soldering

Bosch Automotive Electronics Limited - Bangalore

1. Ensure manufacturing process compliance with legal & safety requirements, engineering principles, customer requirements, Bosch standards and process specifications.
2. Responsible to maintain the KPIs within target Utilization, FPY, IDC (Scrap)
3. Improve productivity by reducing downtimes and optimizing in CT
4. Internal and Customer defect elimination with A3PSS and PDCA approach
5. Responsible to design and procure the respective tooling
6. Responsible to set up process parameters and creation of program
7. Prepare, execute, document technical readiness for NPI & ECR.
8. 2nd level machine downtime problem solving and developing concepts for high machine uptime.
9. Should have capability to represent in the internal and external meetings
10. Responsible to set up profile for both RoHS & Non-RoHS products
11. To monitor and work on the continuous improvements
12. Participation PFMEA & CP improvements along with CFT
13. Implement Benchmark practices (internal / external)
14. Responsible to convert the available data into usable data and visualize the data to define the actions 
15. Knowledge exchange with IPN / CoC for pain areas in maintenance area.
16. Benchmark, Localization, tool life improvement.
17. Work on ergonomic improvements, effluent reduction and safety improvements
18. Cost reduction

B.E (3 to 5 years of exp) in Electrical & Electronics Engineering, Mechatronics, Electronics Manufacturing, Industrial Automatization

Technical Competencies expected

1. Basic Knowledge in SMT
2. Complete knowledge in Solder Paste Printing and Reflow Process are required
3. Problem solving methodology with deep dive root cause analysis, PDCA, A3 PSS, 4M, 5 Why analysis FMEA etc.
4. Hands-on experience in installation of Solder Paste Printing and Reflow Process machines are required
5. Understanding of parameters and settings which would affect the cycle time
6. Depth knowledge in SPP programming with troubleshooting and thermal profiling of reflow soldering are required
7. Knowledge in machine telegrams & communication with MES is required

Deliverables

1. Validation of line design and capacity through simulations.
2. Recommend and plan to deploy the validated simulations.
3. Specify and implement cost saving measures (CT, productivity, consumables, tools etc.)
4. Problem Solving for Customer Complaint topics (0km/field failures.)
5. Continuous Improvement topics from IDC, utilization.
6. RPP (CT, productivity, consumables, tools)
7. Awareness EHS (Environmental Health and Safety)

8. ESD compliance