Principal IC Package Design Engineer

About the Company

Cadence Bangalore is Hiring

About the Role

We are seeking an experienced IC Package Design Engineer with strong expertise in flipchip package design and ICPackagePCB codesign, focusing on signal integrity (SI), power integrity (PI), and thermal optimization. The role requires close collaboration with crossfunctional teams and customers to deliver optimized, costeffective, and highperformance package solutions.

Responsibilities

• Lead flipchip package design with a strong focus on SI/PI and thermal constraints.
• Drive ICPackagePCB codesign, balancing performance, power, cost, technology, and thermal tradeoffs.
• Collaborate closely with crossfunctional teams and customers to define and deliver optimal endtoend solutions.
• Support die floorplanning, IO placement and perform bump definition, routing feasibility analysis, and optimization of Package stackup, BGA ball map and PCB design interfaces.
• Execute 2D/3D EM simulations and apply electromagnetic and transmission line theory to package design challenges.
• Extract and analyze Sparameters and RLGC models to ensure package compliance with SI/PI requirements.
• Validate package and PCB designs in the lab, correlating measurements with simulation results.
• Provide clear, concise program status updates to management, highlighting risks, issues, and mitigation plans.
• Drive process improvements, methodology development, innovation, and efficiency gains in package design flows.
• Mentor and support team members while contributing as an individual technical expert.

Qualifications

• Experience: 12+ years
• Education: BE/BTech or MTech in Electrical / Electronics Engineering

Required Skills

• Experience with various Cadence Allegro tools (APD/SIP, PCB Editor)
• Experience with various modeling tools (Cadence Sigrity PowerSI, ExtractIM, Clarity 3D)
• Experience in working with different DRAM protocols, DDR4/5, GDDR6/7, HBM3/4, LPDDR5/6
• Strong understanding of package cost vs. performance tradeoffs
• Proven ability to work independently and in crossfunctional teams
• Highly motivated, proactive, and eager to continuously acquire new skills