Principal Analog Design Engineer

About the Company

Cadence Hyderabad is Hiring for Analog design

About the Role

We are looking for an experienced Principal Analog Design Engineer to drive the design and delivery of highspeed interface IPs, with a strong emphasis on DietoDie (D2D) interconnects based on the UCIe standard and advanced package technologies. The role requires handson ownership from architecture through silicon bringup, working closely with layout, verification, package, and system teams.

Responsibilities

• Architect, design, and deliver highspeed analog / mixedsignal circuits for DietoDie and chipletbased systems, including UCIecompliant interfaces.
• Own analog blocks for highspeed interfaces such as clocking, TX/RX frontends, termination schemes, biasing, and equalization support circuits.
• Drive architecture definition, feasibility analysis, and design tradeoffs considering signal integrity, power, noise, and packaging parasitics.
• Perform schematic design, simulation, and optimization across PVT corners using industrystandard EDA tools.
• Work closely with advanced package teams (2.5D / 3D, interposers, organic substrates) to cooptimize circuit and package design.
• Support layout reviews, parasitic extraction analysis, and postlayout signoff for highspeed performance.
• Collaborate with AMS verification, digital, and system teams to enable fullchip integration and validation.
• Participate in silicon bringup, debug, and characterization, including correlation with simulation results.
• Contribute to design methodology, checklists, and best practices for highspeed analog and D2D designs.

Qualifications

• Bachelors or Masters degree in Electrical / Electronics Engineering or related field.
• 8+ years of handson experience in analog / mixedsignal IC design.

Required Skills

• Strong experience with highspeed interface design (e.g., DDR, PCIe, SerDes, DietoDie links).
• Solid understanding of UCIe standard concepts, D2D PHY requirements, and chiplet architectures.
• Experience working with advanced packaging technologies and understanding packageinduced effects on highspeed signaling.
• Proficiency in schematiclevel design, simulation, and debug across PVT corners.
• Strong fundamentals in analog circuit theory, signal integrity, noise analysis, and clocking.

Preferred Skills

• None specified.