Loading...
🔔 FCM Loaded

Physical Design EM IR ESD Lead

Stealth Mode AI Semiconductor

5 - 10 years

Bengaluru

Posted: 28/02/2026

Getting a referral is 5x more effective than applying directly

Job Description

Location: Bengaluru, India Experience: 1015 years Industry: Semiconductors | AI | Networking | ASIC Design


Role Overview

As the Physical Design EM/IR/ESD Lead you will be the ultimate guardian of our

silicon reliability and power integrity. In the high-stakes world of AI SOCs, power delivery is the

heartbeat of the chip. You will hold end-to-end ownership of the EM/IR and ESD strategy,

bridging the gap between ambitious architectural power demands and robust, manufacturable

physical implementation. This is a leadership role designed for an expert who thrives on defining

methodologies from scratch and ensuring first-pass silicon success.


Key Responsibilities

Methodology & Flow Development

Define & Own EM/IR/ESD Flow: Design, develop, and maintain a robust, automated,

and scalable physical design flow for Electromigration (EM), Static/Dynamic IR-Drop (IR),

and ESD analysis.

PDN Leadership: Lead the definition of the SoC-level Power Distribution Network

(PDN) architecture. Drive partition-level teams to meet aggressive IR-drop and power

integrity specifications.

ESD/LUP Strategy: Collaborate with integration and floorplanning teams to implement

essential ESD and Latch-Up protection elements (HBM, CDM) across the chip.

Advanced Sign-off: Develop innovative methodologies to enhance accuracy and

reduce Turn-Around-Time (TAT) for reliability sign-off.

Tool Expertise & Vendor Collaboration


Evaluation & Benchmarking: Lead the selection and deployment of best-in-class EDA

tools (e.g., Ansys RedHawk SC, Cadence Voltus, Calibre PERC).

Vendor Engagement: Serve as the primary technical interface with EDA vendors,

driving feature enhancements and influencing tool roadmaps to meet project-critical

requirements.

Technical Leadership & Support

Subject Matter Expertise: Act as the SME for all reliability aspects, providing

expert-level support on complex sign-off challenges and final tape-out criteria.

Cross-Functional Synergy: Partner with Foundry teams to incorporate

technology-specific rules and with Device/Layout teams to optimize protection structures.


Key Skills & Technical Requirements

EM/IR Sign-off Mastery: Expert proficiency in analyzing static/dynamic IR-drop and

identifying EM violations on advanced nodes.

Tool Proficiency: High proficiency with Ansys RedHawk SC and/or Cadence Voltus.

ESD/LUP Excellence: Mastery of ESD/Latch-Up protection concepts and sign-off

procedures using Calibre PERC.

Physical Design Fundamentals: Deep understanding of floorplanning, power grid mesh

creation, P&R, and timing analysis.

Scripting & Automation: Expert-level proficiency in Python, Tcl, or Perl is essential for

building and automating custom flows.


Background & Qualifications

Education: Bachelors or Masters degree in Electrical/Electronics Engineering or a

related field.

Experience: 1015 years in VLSI physical design, with a dedicated focus on power

integrity and reliability.

Process Technology: Proven track record on advanced process nodes (7nm, 5nm,

and below) is highly desirable.

Soft Skills: Exceptional analytical debugging skills and the ability to articulate complex

sign-off statuses to cross-functional stakeholders.

Services you might be interested in

Improve Your Resume Today

Boost your chances with professional resume services!

Get expert-reviewed, ATS-optimized resumes tailored for your experience level. Start your journey now.