Module Lead - Embedded Hardware

Job description:

1. Design, analyze, and validate high-speed electronic systems to ensure reliable signal transmission and robust power delivery across circuit boards, packages, and system-level designs
2. Work cross-functionally with hardware, PCB design, and package engineering teams to optimize electrical performance
3. Perform comprehensive SI/PI simulations, measurements, and troubleshooting to meet product performance requirements
4. Design and simulate PCB and package layouts for signal integrity and power integrity requirements
5. Perform end-to-end high-speed channel simulations including S-parameter extraction, eye diagram analysis, and compliance testing
6. Conduct power delivery network (PDN) analysis including target impedance calculations, decoupling capacitor optimization, and IR drop analysis
7. Develop and review design guidelines, stackup specifications, and interface requirements
8. Troubleshoot signal and power integrity issues in pre-silicon and post-silicon phases
9. Analyze high-speed interfaces (DDR3/4/5, PCIe Gen3/4/5, USB 2.0/3.x, HDMI, DisplayPort, SATA, Ethernet) for compliance and performance optimization
10. Document simulation results, test reports, and design recommendations for analysis.

Qualifications and skills needed:

1. Bachelor's or Master's degree in Electronics Engineering, or related field
2. 3-5+ years of hands-on experience in SI/PI analysis and high-speed digital design
3. Deep understanding of electromagnetic theory, transmission lines, S-parameters, and impedance matching
4. S-parameter analysis, eye diagram interpretation, jitter analysis, and crosstalk evaluation
5. Target impedance calculation, decoupling strategy, plane design, and IR drop analysis

Experience Range:

3 to 8 years