IC Package Development Engineer

About Axiro Semiconductor

Axiro Semiconductor is a fabless semiconductor design company headquartered in Bengaluru, driving innovation in RF, wireless infrastructure, satellite communication (Satcom), and high-speed connectivity solutions. Backed by CG Power & Industrial Solutions Ltd. part of the 120-year-old Murugappa Group. Axiro represents Indias leap into the global semiconductor arena. With millions of chips already powering global networks, a world-class team across India, the US, and Europe, and cutting-edge expertise spanning RF, mmWave, GaN, and next-generation communication technologies, Axiro is engineering the future of how the world connects, computes, and communicates.

Job Description

• Bachelors degree in Mechanical Engineering, Materials Science, Electrical Engineering, or a related field.
• Strong interest in semiconductor packaging, microelectronics, or materials engineering.
• Solid understanding of engineering fundamentals, including materials properties, thermomechanical behavior, and manufacturing concepts.
• Familiarity with technical drawings, BOM structures, and basic documentation control.
• Proficient in Microsoft Excel, PowerPoint, and basic data analysis tools.
• Strong written and verbal communication skills.
• Eagerness to learn and contribute in a fast-paced, cross-functional environment.