IC Design Engineer

HARMAN’s engineers and designers are creative, purposeful and agile. As part of this team, you’ll combine your technical expertise with innovative ideas to help drive cutting-edge solutions in the car, enterprise and connected ecosystem. Every day, you will push the boundaries of creative design, and HARMAN is committed to providing you with the opportunities, innovative technologies and resources to build a successful career.

A Career at HARMAN

As a technology leader that is rapidly on the move, HARMAN is filled with people who are focused on making life better. Innovation, inclusivity and teamwork are a part of our DNA. When you add that to the challenges we take on and solve together, you’ll discover that at HARMAN you can grow, make a difference and be proud of the work you do everyday.

As an IP leader, you will be part of a team of 20-30 people including RF IC architects, RF Design Engineers, Verification/modeling Engineers, Functional Safety eng. The capabilities in the team enable innovation and product development of RF & mmW IC products, from roadmap request up to full market release. The team is working on IC products for high grade Radar Automotive application.

The projects are executed in close cooperation with other Product R&D Centers.

Your Responsibilities:

As a key member of the team, you will be responsible for:

• Piloting microwave blocks design in advanced CMOS technology
• Lead designers (3-6) who do Ips development, ensure main IP reaches the KPIs
• Make sure performances, Quality, Schedule targets are met
• In collaboration with our system engineers and in partnership with our OEM customers, you will define the architecture and topologies to meet the challenges of the overall system, from major electrical performance to low cost integration.
• Your high level of creativity combined with your successful experiences will enable you to design advanced solutions adapted to high volume production.
• You will be integrated in a worldwide team
• You will participate to the evaluation of the IP design, assisting the product and test engineering teams during the qualification and production phases

Your Profile:

• >10 years’ experience in RF IC design, with broad experience in mmW design. As IP lead > 2 years
• Leadership proven ability ; wide technical knowledge, from design to industrialization
• Strong background in semiconductor physics
• Experience of relevant CAD tools (Cadence flow) and IC design methodology
• Experience with EMC simulation tools allowing to secure the IC performances at high frequencies, simulating die-package-PCB.
• Structured IC design methodology covering specification, implementation, design and test
• Driven to achieve success and able to work in a team of expert engineers to reach clear design goals
• Fluent in English language both oral and written
• Excellent communication skills, both verbal and in writing.
• Initiative and entrepreneurial attitude. Creative.
• Work in multicultural and highly complex environments and likes to innovate in product developments.
• Natural sense of leadership and good “spirit”: cooperation with others.

HARMAN is proud to be an Equal Opportunity / Affirmative Action employer. All qualified applicants will receive consideration for employment without regard to race, religion, color, national origin, gender (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, or other applicable legally protected characteristics.