Advanced package Design (APD)
Tata Consultancy Services
2 - 5 years
Bengaluru
Posted: 29/01/2026
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Job Description
Skill - Advanced package Design (APD)
Location- Bangalore
Experience - 5+years
JD
- Good hands-on experience in IC Package Substrate design and Interposer Design
- Familiarity with various package configuration and assembly/substrate technology (wirebond, flipchip, COF)
- Good knowledge of substrate structure, design rules and material property
- Experience of Cadence Allegro tools - Allegro Package Design+/ Allegro SIP, or equivalent
- Experience of Synopsys 3D IC compiler and ICC2 is added advantage
- Design experience with MCM/SiP packages, module schematic and layout design experience
- Knowledge of Complex, High-Speed PCB, and IC Packaging
- Understanding/ experience in scripting Perl/ SKILL programming
- Understanding of DRC and DFM (Design For Manufacturing)
- Understanding in SI/PI tools, package model extraction, S-parameter
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