Failure Analysis Engineer

Failure Analysis (FA) Engineer - PCBA

Role Overview:

The Failure Analysis Engineer is responsible for performing root-cause analysis on defective or failed printed circuit board assemblies (PCBAs). By using destructive and non-destructive testing techniquesspecifically Dye & Pry and Cross-Section Analysisthe engineer identifies physical defects and translates findings into actionable improvements in manufacturing and design.

Key Responsibilities:

• Failure Analysis Execution: Perform Dye & Pry testing on suspect SMT and BGA components to verify solder joint integrity, detect fatigue cracks, pad cratering, and open circuits.
• Cross-Sectioning: Prepare, mount, grind, and polish PCBA samples to analyze internal layer structures, plated through-holes (PTH), intermetallic compounds (IMC), and layer thicknesses.
• Microscopy & Imaging: Utilize optical microscopes and Scanning Electron Microscopes (SEM) to inspect, document, and measure defects found during testing.
• Data Interpretation: Analyze defect data, evaluate findings against industry standards (such as IPC-TM-650 testing protocols), and document detailed FA reports.
• Process Improvement: Collaborate with manufacturing, quality, and process engineering teams to recommend corrective actions and prevent recurring soldering or assembly defects.

Qualifications & Skills:

• Education: Bachelor's or Master's degree in Materials Science, Electronics, Mechanical Engineering, or a related field.
• Experience: Hands-on experience in PCBA lab environments, specifically handling sample preparation, mounting (puck preparation), and optical/chemical microsectioning.
• Industry Standards: Strong working knowledge of IPC workmanship and acceptance criteria (e.g., IPC-A-610, IPC-TM-650).
• Analytical Tools: Experience using optical and metallurgical microscopes; familiarity with X-ray, SEM, and EDS is a strong plus.