Login Sign Up
🔔 FCM Loaded

Chip Lead - DFT

HCLTech

5 - 10 years

Bengaluru

Posted: 13/04/2026

Getting a referral is 5x more effective than applying directly

Job Description

Role Overview

Lead and own chip-level DFT architecture, implementation, and signoff for complex SoCs. Responsible for ensuring high test coverage, manufacturability, and test cost optimization, while driving seamless integration across IPs and subsystems.


Key Responsibilities

DFT Ownership

Own end-to-end chip-level DFT strategy and execution

Define DFT architecture for full chip including scan, MBIST, LBIST, and boundary scan

Ensure DFT readiness from RTL to tapeout


DFT Architecture & Planning

Architect and implement:

Scan insertion and compression (EDT)

MBIST (Memory BIST)

LBIST (Logic BIST)

JTAG / Boundary Scan (IEEE 1149.x)

Define test modes, test clocks, and test access mechanisms (TAM)

Plan and manage test IO requirements and pin muxing


Implementation & Integration

Drive DFT insertion and integration at chip level

Ensure proper integration of:

Third-party IP DFT requirements

Block-level DFT into top-level environment

Work closely with RTL and PD teams for clean implementation


ATP G & Coverage Closure

Own ATPG pattern generation and debug

Achieve high:

Stuck-at coverage

Transition fault coverage

Analyze and close:

Coverage gaps

Untestable faults

Optimize for pattern count and test time


Physical & Timing Awareness

Ensure DFT is:

Timing clean (no test mode violations)

Physically feasible (routing, congestion aware)

Work with STA and PD teams for:

Scan timing closure

Test mode timing validation


Post-Silicon & Manufacturing Support

Support:

Silicon bring-up

ATE debug and yield analysis

Work with test engineers for:

Pattern bring-up

Yield improvement


Cross-Functional Collaboration

Interface with:

RTL / Design teams

Physical Design (PD)

STA team

Validation and ATE teams

Ensure alignment across design, test, and manufacturing


Leadership

Lead and mentor DFT engineers

Drive DFT reviews, checklists, and signoff criteria

Act as final owner for DFT quality and signoff


Required Skills & Expertise

Technical

Strong expertise in:

Scan architecture and compression techniques

ATPG and fault modeling

MBIST/LBIST design and integration

Deep understanding of:

DFT timing challenges

Low-power impact on test (UPF/CPF awareness)


Tools

Hands-on experience with:

Synopsys DFT Compiler / TetraMAX / TestMAX

Cadence Modus

Familiarity with:

STA tools (PrimeTime) for test timing validation


Experience

1218+ years in DFT

Proven experience in:

Chip-level DFT ownership

Multiple successful tapeouts


Soft Skills

Strong debugging and analytical thinking

Ability to lead cross-functional teams

Good communication with stakeholders and customers


Good to Have

Experience with:

Low-power DFT techniques

Hierarchical DFT flows

Automotive / safety (ISO 26262) test requirements

Scripting:

TCL / Python for automation


Success Metrics

High fault coverage (stuck-at, transition)

Optimized pattern count and test time

Smooth silicon bring-up and minimal test escapes

High manufacturing yield

Clean DFT signoff at tapeout

Services you might be interested in

Improve Your Resume Today

Boost your chances with professional resume services!

Get expert-reviewed, ATS-optimized resumes tailored for your experience level. Start your journey now.